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epx-_1

EPX

  • Flash Type: 3D TLC NAND flash
  • Interface: M.2 22110 PCIe NVMe Gen 3x4
  • Seq. Read: Up to 3,000 MB/s
  • Seq. Write: Up to 2,000 MB/s
  • Features: TM/OVP/OCP/ELPM
  • Capacity: 960GB
  • End to End Data Protection
  • Reliable Consistency
  • Ultra Low Latencies
  • Power Loss Protection
  • Low Power Consumption
  • Customized Firmware
  • Available In 960 GB And 1920 GB Capacity
  • NAND RAID Implemented With RAIFE Technology
  • Stream Directive
  • TCG Opal 2.0
  • Machine Learning: Intelligent Read Retry
  • Model EPX
    Capacity 960GB
    Flash Type 3D TLC NAND flash
    Performance
    Seq. Read (MB/s) Up to 1,700
    Seq. Write (MB/s) Up to 750
    Environment and Reliability
    Power Requirement DC 3.3V 2.5A (Max)
    Temperature  0-70 degrees(operating)
    MTBF 1,500,000 hours
    Compatibility
    Agency Approval FCC, CE, VCCI, BSMI, KCC, RCM, TUV, UL, CB
    Command Set Support M.2 PCIE Gen 3x4 NVMe
    Interface M.2 22110 PCIe NVMeGen 3x4
    Form Factor and Connectors
    Form Factor M.2 22110
    Power Connector M.2 connector for DC 3.3V
    Data Connector M.2 connector
    Dimension and Weight
    Dimension (L/W/H) 110.00 mm x 22.00 mm x 5.00 mm
    Weight (Max.) 16g
    Technolgy
    Feature PLP/eDrive/Low power

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      • Flash Type:3D TLC
      • Interface:M.2 PCIE Gen 3x4 NVMe
      • Seq. Read:Up to 3,000 MB/s
      • Seq. Write:Up to 2,000 MB/s
      • Features:AES/TCG OP AL/Wide Temperature
      • Capacity:128G/256G/512G/1024G
      • Flash Type:3D TLC NAND flash
      • Interface:2.5" SATA 3.1 (6Gb/s)
      • Seq. Read:Up to 550 MB/s
      • Seq. Write:Up to 450 MB/s
      • Features:TCG/TM/OVP/OCP/ELPM
      • Capacity:128GB/256GB/512GB
      • Flash Type: 3D TLC NAND flash
      • Interface: M.2 2280 SATA 3.1 (6Gb/s)
      • Seq. Read: Up to 550 MB/s
      • Seq. Write: Up to 450 MB/s
      • Features: TCG/TM/OVP/OCP/ELPM
      • Capacity: 128GB/256GB/512GB